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 HD74LS251
1 of 8 Data Selector / Multiplexer (with strobe and three-state outputs)
REJ03D0467-0300 Rev.3.00 Jul.15.2005 This data selector / multiplexer contains full on-chip binary decoding to select one-of-eight data sources and features a strobe-controlled 3-state output. The strobe must be at a low logic level to enable this device. The 3-state outputs permit a number of outputs to be connected to a common bus. When the strobe input is high, both outputs are in a high-impedance state in which both the upper and lower transistors of each totem-pole output are off, and the output neither drives nor loads the bus significantly. When the strobe is low, the outputs are activated and operate as standard TTL totem-pole outputs. To minimize the possibility that two outputs will attempt to take a common bus to opposite logic levels, the output control circuitry is designed so that the average output disable time is shorter than the average output enable time.
Features
* Ordering Information
Part Name HD74LS251P HD74LS251FPEL Package Type DILP-16 pin SOP-16 pin (JEITA) Package Code (Previous Code) PRDP0016AE-B (DP-16FV) PRSP0016DH-B (FP-16DAV) Package Abbreviation P FP Taping Abbreviation (Quantity) -- EL (2,000 pcs/reel)
Note: Please consult the sales office for the above package availability.
Pin Arrangement
3 2 Data Inputs 1 0 Y Outputs W Strobe GND
1 D3 2 3 4 5 6 7 8 D2 D1 D0 Y W S C D4 D5 D6 D7 A B
16 15 14 13 12 11 10 9
VCC 4 5 Data Inputs 6 7 A B C Data Select
(Top view)
Rev.3.00, Jul.15.2005, page 1 of 5
HD74LS251
Function Table
Inputs C X L L L L H H H H Select B X L L H H L L H H A X L H L H L H L H Strobe S H L L L L L L L L Y Z D0 D1 D2 D3 D4 D5 D6 D7 Outputs W Z D0 D1 D2 D3 D4 D5 D6 D7
Notes: 1. H; high level, L; low level, X; irrelevant 2. Z; high impedance (off-state) 3. D0 through D7; the level of the respective D input.
Block Diagram
Strobe (Enable) D0 D1 D2 Data Inputs D3 D4 D5 D6 D7 A A Data Select (Binary) B C A B B C C Output W Output Y
Absolute Maximum Ratings
Item Supply voltage Input voltage Output voltage (off-state) Operating temperature Power dissipation Storage temperature Symbol VCC VIN VO (off) Topr PT Tstg Ratings 7 7 5.5 -20 to +75 400 -65 to +150 Unit V V V C mW C
Note: Voltage value, unless otherwise noted, are with respect to network ground terminal.
Rev.3.00, Jul.15.2005, page 2 of 5
HD74LS251
Recommended Operating Conditions
Item Supply voltage Output current Operating temperature Symbol VCC IOH IOL Topr Min 4.75 -- -- -20 Typ 5.00 -- -- 25 Max 5.25 -2.6 8 75 Unit V mA mA C
Electrical Characteristics
(Ta = -20 to +75 C)
Item Input voltage Symbol VIH VIL VOH Output voltage VOL IIH IIL II Output current Short-circuit output current Supply current** IOZ IOS ICC min. 2.0 -- 2.4 -- -- -- -- -- -- -- -30 -- -- -- typ.* -- -- -- -- -- -- -- -- -- -- -- 6.1 7.1 -- max. -- 0.8 -- 0.4 0.5 20 -0.4 0.1 20 -20 -130 10 12 -1.5 Unit V V V V A mA mA A mA mA Condition
VCC = 4.75 V, VIH = 2 V, VIL = 0.8 V, IOH = -2.6 mA IOL = 4 mA VCC = 4.75 V, VIH = 2 V, VIL = 0.8 V IOL = 8 mA VCC = 5.25 V, VI = 2.7 V VCC = 5.25 V, VI = 0.4 V VCC = 5.25 V, VI = 7 V VO = 2.7 V VO = 0.4 V VCC = 5.25 V Condition A VCC = 5.25 V Condition B VCC = 4.75 V, IIN = -18 mA VCC = 5.25 V, VIH = 2 V
Input current
Input clamp voltage VIK V Notes: * VCC = 5 V, Ta = 25C ** ICC is measured with the outputs open and all data and select inputs at 4.5 V under the following conditions. A; Strobe grounded, B; Strove at 4.5 V
Switching Characteristics
(VCC = 5 V, Ta = 25C)
Item Symbol tPLH tPHL tPLH tPHL tPLH tPHL tPLH tPHL tZH tZL tZH tZL tHZ tLZ tHZ tLZ Inputs A, B, C (4 level) A, B, C (3 level) Data Data Strobe Strobe Strobe Strobe Outputs Y W Y W Y W Y W min. -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- typ. 29 28 20 21 17 18 10 9 30 26 17 24 30 15 37 15 max. 45 45 33 33 28 28 15 15 45 40 27 40 45 25 55 25 Unit Condition
Propagation delay time
ns CL = 15 pF, RL = 2 k
Output enable time
ns
Output disable time
ns
CL = 5 pF, RL = 2 k
Rev.3.00, Jul.15.2005, page 3 of 5
HD74LS251
Testing Method
Test Circuit
VCC
4.5V Load circuit 1 RL S D0 D1 D2 D3 D4 D5 D6 D7 A B C
See Function Table
Output W
S1
Input P.G. Zout = 50
5k CL
S2
Output Y Same as Load Circuit 1.
Notes:
1. CL includes probe and jig capacitance. 2. All diodes are 1S2074(H).
Waveform
tTHL Enable 90% 1.3V 3V 10% tZL 4.5V Waveform 1
S1 closed, S2 open
tTLH 90% 1.3V 3V 0V tLZ
S1 and, S2 closed
0V
10%
1.3V VOL tHZ VOH 0.5V
1.5V VOL VOH 1.5V
tZH Waveform 2
S1 open, S2 closed
1.3V 0V
0.5V
S1 and, S2 closed
Notes:
1. Input pulse; tTLH 15 ns, tTHL 6 ns, PRR = 1 MHz, duty cycle = 50% 2. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. 3. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
Rev.3.00, Jul.15.2005, page 4 of 5
HD74LS251
Package Dimensions
JEITA Package Code P-DIP16-6.3x19.2-2.54 RENESAS Code PRDP0016AE-B Previous Code DP-16FV MASS[Typ.] 1.05g
D
16
9
1 0.89 b3
8
Z
E
A1
A
Reference Symbol
Dimension in Millimeters Min Nom 7.62 19.2 6.3 20.32 7.4 5.06 0.51 0.40 0.48 1.30 0.19 0 2.29 2.54 0.25 0.31 15 2.79 1.12 2.54 0.56 Max
e D E
L
1
A A1
e
bp
e1
b c b c
p 3
e Z ( Ni/Pd/Au plating ) L
JEITA Package Code P-SOP16-5.5x10.06-1.27
RENESAS Code PRSP0016DH-B
Previous Code FP-16DAV
MASS[Typ.] 0.24g
*1
D F 9
16
NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET.
bp
HE
E
Index mark
Reference Symbol
*2
c
Dimension in Millimeters Min Nom 10.06 5.50 Max 10.5
Terminal cross section ( Ni/Pd/Au plating )
1 Z e
*3
D E A2
8 bp x M L1
A1 A bp b1 c
0.00
0.10
0.20 2.20
0.34
0.40
0.46
0.15
1
0.20
0.25
A
c
HE
0 7.50 7.80 1.27
8 8.00
A1
y L
e x y
0.12 0.15 0.80 0.50
1
Detail F
Z L L 0.70 1.15
0.90
Rev.3.00, Jul.15.2005, page 5 of 5
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> 2-796-3115, Fax: <82> 2-796-2145
http://www.renesas.com
Renesas Technology Malaysia Sdn. Bhd. Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510
(c) 2005. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .3.0


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